2 functional specification, Processor, Functional specification – Kontron COMe-bIP6 User Manual

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COMe-bIP6 / Product Specification

3.2

Functional Specification

Processor

The 22nm Intel® 3rd Gen Core™ i7/i5/i3/Celeron® embedded (Ivy Bridge) CPU family with 31x24mm package size
(FCBGA1023 socket) supports:

» Intel® Turbo Boost Technology 2.01

» Intel® 64

» Intel® Virtualization Technology (VT-x)

» Intel® Virtualization Technology for Directed I/O (VT-d)

» AES New Instructions (AES-NI)

» Intel® Hyper-Threading Technology

» Enhanced Intel SpeedStep® Technology

» Idle States (C-States)

» Intel® Smart Cache

» Thermal Monitoring Technologies

» Intel® Fast Memory Access

» Intel® Flex Memory Access

» Integrated Intel® HD Graphics with Dynamic Frequency

» Configurable Thermal Design Power (cTDP)

Optional available (with customized BIOS):

» Intel® vPRO™ Technology including:

» Intel® Active Management Technology (AMT)

» Intel® Trusted Execution Technology (TXT)

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