Kontron COMe-bIP6 - Manual (Page 30)

COMe-bIP6 / Product Specification
3.11 Mechanical Specification
Dimension
» 95.0 mm x 125.0 mm
» Height approx. 12mm (0.4”)
CAD drawings are available at EMD CustomerSection
Height
The COM Express® specification defines a module height of 13mm from module PCB bottom to heatspreader top:
Cooling solutions provided from Kontron Europe GmbH for basic sized Computer-on-Modules are 27mm in height from
module bottom to Heatsink top.
Universal Cooling solutions to be mounted on the HSP (36099-0000-00-x) are 14.3mm in height for an overall height of
27.3mm from module bottom to Heatsink top.
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