Fs781 b s, Marking example package drawing and dimensions, Lead (150-mil) soic s8 – Cypress FS782 User Manual

Page 10

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FS781/82/84

Document #: 38-07029 Rev. *F

Page 10 of 12

Marking Example

Package Drawing and Dimensions

Cypress
FS781BS
Date Code, Lot #

Cypress
FS781BT
Date Code, Lot #

FS781 B S

Cypress Device Driver

Revision

Package
S = SOIC
T = TSSOP

SEATING PLANE

PIN 1 ID

0.230[5.842]

0.244[6.197]

0.157[3.987]

0.150[3.810]

0.189[4.800]

0.196[4.978]

0.050[1.270]

BSC

0.061[1.549]

0.068[1.727]

0.004[0.102]

0.0098[0.249]

0.0138[0.350]

0.0192[0.487]

0.016[0.406]

0.035[0.889]

0.0075[0.190]

0.0098[0.249]

1. DIMENSIONS IN INCHES[MM] MIN.

MAX.

0°~8°

0.016[0.406]

0.010[0.254]

X 45°

2. PIN 1 ID IS OPTIONAL,

ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME

0.004[0.102]

8 Lead (150 Mil) SOIC S08

1

4

5

8

3. REFERENCE JEDEC MS-012

PART #

S08.15 STANDARD PKG.

SZ08.15 LEAD FREE PKG.

4. PACKAGE WEIGHT 0.07gms

8-lead (150-Mil) SOIC S8

51-85066-*C

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