Interlink Electronics MicroModule PS2 User Manual
Page 2
www.interlinkelectronics.com
PS2 MicroModule
Integration Guide
Table of Contents
1.0
Introduction.................................................................................................................... 1
2.0
Scope ................................................................................................................................ 1
3.0
Theory of Operation .................................................................................................... 2
4.0
Features and Operation ............................................................................................. 4
4.1
Using the Pressure-Sensing Actuator ................................................................... 4
4.2
Clicking and Dragging ........................................................................................... 4
5.0
Mounting .......................................................................................................................... 5
5.1
Suggested Panel Cut-out ...................................................................................... 5
5.2
Mounting MicroModule .......................................................................................... 6
5.3
Supporting MicroModule’s PCB ............................................................................ 7
5.4
Sealing MicroModule with Silicone Sealant........................................................... 7
6.0
Connection ..................................................................................................................... 8
6.1
Molex Header/Mating Connector Specifications ................................................... 8
6.2
PS/2 Interface Connections ................................................................................... 9
6.3
Cable Options ...................................................................................................... 10
7.0
PS/2 Information ......................................................................................................... 11
7.1
Data Packet ......................................................................................................... 11
7.2
Operating Voltage and Current ........................................................................... 12
8.0
Drawings and Dimensions ....................................................................................... 13
9.0
Orderable Part Numbers .......................................................................................... 15
10.0
Intellectual Property & Other Legal Matters .................................................... 15
11.0
Contact Interlink Electronics ................................................................................ 16