Interlink Electronics Micro Joystick - Manual (Page 26)

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MicroJoystick
Integration Guide
7.0 DOs and DON’Ts
DO’s
 Do prototype the VersaPoint system before proceeding into Production.
In the prototyping phase, the lifetime, durability, manufacturability, ergonomics and
performance of the MicroJoystick should all be thoroughly investigated to ensure they meet
your requirements.
 Do mechanically reinforce the Z-axis pressure-sensitive adhesive joint.
If Z-axis pressure sensitive adhesive is used as the connection method, a compressive force
should be applied to the joint to prevent adhesive delamination.
 Do mechanically reinforce the Z-axis pressure-sensitive adhesive joint immediately
after assembly.
This will prevent the adhesive from delaminating and being exposed to contaminants.
 Do use an adhesive primer with Z-axis pressure-sensitive adhesive.
This will help increase the mechanical strength of the joint.
DON’Ts
 Do not solder directly to the exposed conductive traces.
With flexible substrates, the solder joint will not hold and the substrate can easily melt and
distort during soldering.
 Do not expose the MicroJoystick to Liquids
 Do not screw into two surfaces when mounting.
The self-contained design of the MicroJoystick makes it highly resistant to contamination and
failure caused by dust or liquids. In general, the MicroJoystick is better protected than the
keyboard or system into which it is integrated. However, the MicroJoystick is NOT sealed against
liquids. Exposure to moisture could affect the flex-circuit connection juncture. There is a small
vent at the base of the stick, opposite the connection juncture; the joystick’s operation may be
impaired if moisture enters this vent.