Lanner LEC-3012 - Manual (Page 19)

19
Introduction
Chapter 4
Embedded and Industrial Computing
Installing the System Memory
The motherboard supports DDR3 memory that features
data transfer rates of 1066/1333 MHz to meet the higher
bandwidth requirements of the latest operating system
and Internet applications. It comes with one Double Data
Rate 3 (DDR3) Small Outline Dual Inline Memory Module
(SO-DIMM) socket.
Align the memory module’s key with the SO-DIMM 1.
socket’s key.
Install the SO-DIMM.
2.
Note:
SO-DIMMs installed should meet the required 1.
speed which is 1066/1333 MHz. Do not install SO-
DIMM supporting different speeds.
The motherboards can support up to 2 GB 2.
memory capacity in maximum.
Chapter 4:
Hardware Setup
Preparing the Hardware Installation
To access some components and perform certain service
procedures, you must perform the following procedures
first.
WARNING: To reduce the risk of personal injury,
electric shock, or damage to the equipment,
remove the power cord to remove power from
the server. Portions of the power supply and some
internal circuitry remain active until power is
removed.
Unpower the LEC-3012 and remove the power cord. 1.
The top cover has an L shape. Unscrew the 2 threaded 2.
screws at the top from the front panel and the 2 screws
at the bottom from the opposite side. Also unscrew
the two knots to loose the VGA port.
Slide the cover backwards to open the top cover
3.
upwards.
Unscrew 4 screws from each side of the LEC-3012
4.
System and take off the side panel.