EPoX Computer EP-6VBA - Manual (Page 8)

Introduction
EP-6VBA
Page 1-2
Overview
Pentium ® II or Pentium ® III Processor
The Pentium ® II or Pentium ® III Processor is the follow-on to the Pentium ®
Processor. The Pentium ® II or Pentium ® III Processor, like the Pentium ® Pro
processor, implements a Dynamic Execution micro-architecture -- a unique
combination of multiple branch prediction, data flow analysis, and speculative
execution. This enables the Pentium
® II Processor to deliver higher performance
than the Pentium ® processor, while maintaining binary compatibility with all
previous Intel architecture processors.
A significant feature of the Pentium ® II or Pentium ® III Processor, from a system
perspective, is the built-in direct multiprocessing support. In order to achieve
multiprocessing, and maintain the memory and I/O bandwidth to support it, new
system designs are needed. For systems with dual processors, it is important to
consider the additional power burdens and signal integrity issues of supporting
multiple loads on a high speed bus. The Pentium
® II or Pentium ® III Processor
can supports both uni-processor and dual processor implementations.
The Pentium ® II or Pentium ® III Processor utilizes Single Edge Contact (S.E.C.)
(Figure 1) cartridge packaging technology. The S.E.C. cartridge allows the L2
cache to remain tightly coupled to the processor, while maintaining flexibility when
implementing high performance processors into OEM systems. The second level
cache is performance optimized and tested at the cartridge level. The S.E.C.
cartridge utilizes surface mounted core components and a printed circuit board
with an edge finger connection. The S.E.C. cartridge package introduced on the
Pentium
® II Processor will also be used in future Slot 1 processors.
The S.E.C. cartridge has the following features: a thermal plate, a cover and a
PCB with an edge finger connection. The thermal plate allows standardized
heatsink attachment or customized thermal solutions. The thermal plate enables a
reusable heatsink to minimize fit issues for serviceability, upgradeability and
replacement. The full enclosure also protects the surface mount components.
The edge finger connection maintains socketabilty for system configuration. The
edge finger connector is denoted as ‘Slot 1 connector’ in this and other
documentation.