Enterasys Networks XSR-3020 - Manual (Page 87)

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Specifications
System Specifications
This appendix details XSR data about hardware functionality including:
• Processor, system memory, chassis, power supply, interfaces
• Required cabling, optional CompactFlash and other accessories
• Pinout assignments for WAN and LAN interfaces
• LED behavior
Refer to tables throughout this appendix for specific information.
Table A-1 XSR Hardware Specifications
Category Parameters
Processor Type Broadcom 1250 with two CPU cores
Dual-core
Operating Speed 1700 Dhrystone MIPS @ 600 Mhz
Hardware
accelerator VPN Encryption Module chip (310 Mbps) for 3DES encryption, message
digest (MD-5, SHA-1), public key acceleration
System
Memory RAM Micron 184-pin, SDRAM DIMM, 128 Mbyte memory modules at 133
MHz (total 256 MBytes)
Non-Volatile 8 Mbytes of Onboard Flash - no upgrade
Up to 1 Gbyte optional plug-in CompactFlash card. Type I and II CF
cards supported
Chassis Form Factor 19-inch rack-mountable
Dimensions 1U (1-11/16 inches high by 17 inches wide by 21 inches deep)
Weight 17 pounds
Heat
Dissipation Forced air cooling Maximum heat release of a fully configured system is 443.3 BTU/hr
Environment Operating temp. 0 - 40° C
Storage temp. -40 - 70° C
Relative Humidity 5% - 90%, non-condensing