Document Outline

• 1 User Information
  • 1.1 About this Document
  • 1.2 Copyright Notice
  • 1.3 Trademarks
  • 1.4 Standards
  • 1.5 Warranty
  • 1.6 Technical Support
  • 1.7 Environmental Protection Statement
  • 1.8 RoHS Commitment
    • 1.8.1 RoHS Compatible Product Design
    • 1.8.2 RoHS Compliant Production Process
    • 1.8.3 WEEE Application
  • 1.9 Swiss Quality
  • 1.10 The Swiss Association for Quality and Management Systems
• 2 Introduction
  • 2.1 MSM800BEV Ordering Information
  • 2.2 MSM800BEV Applications
  • 2.3 MSM800BEV Features
    • 2.3.1 The MSM800BEV Model
  • 2.4 Block Diagram
    • 2.4.1 MSM800BEV
  • 2.5 MICROSPACE® Documentation
  • 2.6 Product Photo
    • 2.6.1 MSM800BEV
• 3 Specifications
• 4 Quick Start Guide
  • 4.1 Print Manuals from the Product CD
  • 4.2 The MSM800CON, Part Nr. 803036
  • 4.3 The LANCON, Part Nr. 803046
  • 4.4 The DVICON, Part Nr. 803042
  • 4.5 Connect Peripherals to the Board
  • 4.6 The Development Kit, Part Nr. 802118
  • 4.7 Power Up the Board
  • 4.8 BIOS Setup
  • 4.9 Boot Up the Operating System and Install the Drivers
• 5 Connectors & Jumpers
  • 5.1 Connectors
    • 5.1.1 Top Side of the MSM800BEV V2.1
    • 5.1.2 Bottom Side of the MSM800BEV V2.1
    • 5.1.3 X1 Power Supply
    • 5.1.4 X10 VGA Monitor (CRT-signals)
    • 5.1.5 X15 LCD TFT Interface (flat panel signals)
    • 5.1.6 X29 Sound/Audio Port
    • 5.1.7 X30 Printer Port (Centronics)
    • 5.1.8 X31 Keyboard PS/2/-Mouse Utility Connector
    • 5.1.9 X33 10/100 BASE-T Interface Connector
    • 5.1.10 X38 Serial Port COM1
    • 5.1.11 X39 Serial Port COM2
    • 5.1.12 X44 IrDA Connector
    • 5.1.13 X50 USB 1 Connector
    • 5.1.14 X51 USB 2 Connector
    • 5.1.15 X52 USB 3 Connector
    • 5.1.16 X53 USB 4 Connector
    • 5.1.17 X60 IDE Interface
    • 5.1.18 X70 Floppy Disk Interface Connector
    • 5.1.19 X101 PC/104+ BUS Interface
    • 5.1.20 X102 PC/104 BUS Interface
    • 5.1.21 X110 LPC-Port
    • 5.1.22 X230 JTAG-Port
  • 5.2 Jumpers
    • 5.2.1 The Jumpers on the MSM800BEV
• 6 Detailed System Description
  • 6.1 Incompatibilities to a Standard PC/AT
    • 6.1.1 PC104 BUS / ISA BUS
    • 6.1.2 Keyboard versus NUM-Lock
  • 6.2 Related Application Notes
  • 6.3 High Frequency Radiation (to meet EN55022)
    • 6.3.1 For Peripheral Cables
    • 6.3.2 For Stack-Through Applications
    • 6.3.3 Power Supply
  • 6.4 Battery Lifetime
    • 6.4.1 External Battery Assembly:
  • 6.5 Power Requirements
  • 6.6 Boot Time
  • 6.7 CPU, Boards and RAMs
    • 6.7.1 CPUs of this MICROSPACE Product
    • 6.7.2 Numeric Coprocessor
    • 6.7.3 DDRAM Memory on MSM800BEV
  • 6.8 Interfaces
    • 6.8.1 AT Compatible Keyboard & PS/2 Mouse X31
    • 6.8.2 Line Printer Port LPT1
    • 6.8.3 Serial Ports COM1-COM2
    • 6.8.4 Floppy Disk Interface
    • 6.8.5 Speaker Interface
  • 6.9 Controllers
    • 6.9.1 Interrupt Controllers
  • 6.10 Timers and Counters
    • 6.10.1 Programmable Timers
    • 6.10.2 RTC (Real Time Clock)
    • 6.10.3 Watchdog
  • 6.11 CMOS RAM Map
    • 6.11.1 CMOS Map
  • 6.12 EEPROM saved CMOS Setup
    • 6.12.1 EEPROM Memory for Setup
  • 6.13 Memory & I/O Map
    • 6.13.1 System Memory Map
    • 6.13.2 System I/O Map
• 7 System Resources
  • 7.1 Bus Signals
    • 7.1.1 PC104 Bus
    • 7.1.2 PC104+ Bus
    • 7.1.3 Expansion Bus
    • 7.1.4 Addressing PCI Devices
  • 7.2 VGA/LCD
    • 7.2.1 VGA/LCD Controller of the Geode LX800
    • 7.2.2 Graphic Modes
    • 7.2.3 DVICON Resolution
    • 7.2.4 Flat Panel Functional Description
  • 7.3 Cable Interfaces
    • 7.3.1 The Hard Disk Cable 44pin
    • 7.3.2 The COM 1/2 Serial Cable
    • 7.3.3 The Printer Cable
    • 7.3.4 The Micro-Floppy Cable
    • 7.3.5 The LAN Cable (RJ45)
• 8 Design Considerations
  • 8.1 Dimensions and Diagrams
    • 8.1.1 Board Dimensions
    • 8.1.2 Top of BEV board with small heat sink (Option 807041)
    • 8.1.3 BEV board profile with small heat sink (Option 807041) and CompactFlash (Option 807007)
    • 8.1.4 3D perspective, bottom of BEV board, with L+ (Option 807006)
    • 8.1.5 3D perspective, bottom of BEV board with CompactFlash (Option 807007)
    • 8.1.6 Top of BEV board with large heat sink (Option 807042)
    • 8.1.7 BEV board profile with large heat sink (Option 807042) and CompactFlash (Option 807007)
    • 8.1.8 3D perspective, top of BEV board with large heat sink (Option 807042)
    • 8.1.9 Top of BEV board with thermojunction (Option 807043)
    • 8.1.10 BEV board profile with thermojunction (Option 807043) and CompactFlash (Option 807007)
    • 8.1.11 3D perspective, top of BEV board with thermojunction (Option 807043)
    • 8.1.12 MSM800LVDSCON
    • 8.1.13 MSM800DVICON
    • 8.1.14 MSM800CON
  • 8.2 Assembly Views
    • 8.2.1 MSM800BEV V2.1, Top View
    • 8.2.2 MSM800BEV V2.1, Bottom View
  • 8.3 Thermoscan
  • 8.4 Thermal Specifications
• 9 BIOS
  • 9.1 BIOS History
  • 9.2 Core BIOS Download
    • 9.2.1 Before downloading a BIOS
    • 9.2.2 Start the download
    • 9.2.3 If the download does not work
  • 9.3 ROM-BIOS Sockets
    • 9.3.1 Standard BIOS ROM
  • 9.4 BIOS CMOS Setup
• 10 Previous Product Versions
  • 10.1 Board Dimensions – Versions 1.0 / 1.1 / 1.2
  • 10.2 Assembly Views
    • 10.2.1 Top Side of the MSM800BEV V1.1
    • 10.2.2 Bottom Side of the MSM800BEV V1.1
  • 10.3 Connectors and Jumpers of Previous Product Versions
    • 10.3.1 Description of the Connectors for V1.0 /V1.1 /V1.2
• 11 Appendix A: Architecture Information
  • 11.1 Buses
    • 11.1.1 ISA, Standard PS/2 – Connectors
    • 11.1.2 PCI/104
  • 11.2 General PC Architecture
  • 11.3 Ports
    • 11.3.1 RS-232 Serial
    • 11.3.2 Serial ATA
    • 11.3.3 USB
  • 11.4 Programming
• 12 Appendix B: Document Revision History
• 13 Index