Rcv56hcf pci/cardbus modem designer’s guide – Hayes Microcomputer Products RCV56HCF User Manual

Page 42

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RCV56HCF PCI/CardBus Modem Designer’s Guide

ROCKWELL PROPRIETARY INFORMATION

1129

3-20

3.2.3 MDP

The MDP digital electrical characteristics for the hardware interface signals are listed in Table 3-9.

The MDP analog electrical characteristics for the hardware interface signals are listed in Table 3-10.

Table 3-9. MDP Digital Electrical Characteristics

Parameter

Symbol

Min.

Typ.

Max.

Units

Test Conditions1

Input High Voltage

V

IH

VDC

Type IA

2.0

VCC + 0.3

Type IE

4.0

Note 2.

Input High Current

I

IH

µA

VIN= 3.6 V, VCC = 3.6 V

Type IB

40

Input Low Voltage

V

IL

VDC

Type IA

–0.3

0.8

Type IE

1.0

Note 2.

Input Low Current

I

IL

-40

µA

Input Leakage Current

I

IN

±2.5

µADC

V

IN

= 0 to 3.3V, V

CC

= 3.6 V

Output High Voltage

V

OH

VDC

Type OA

2.4

I

LOAD

= – 100 µA

Type OB

2.4

I

LOAD

= 0 mA

Output Low Voltage

V

OL

VDC

Type OA

0.4

I

LOAD

= 1.6 mA

Type OB

0.4

I

LOAD

= 0.8 mA

Three-State (Off) Current

I

TSI

±10

µADC

V

IN

= 0 V to VCC

Capacitive Load

C

L

pF

Types IA and ID

10

Type IB

20

Capacitive Drive

C

D

pF

Types OA and OB

10

Circuit Type

Type IA

TTL

Type IB

TTL with pull-up

Type ID

~RES

Types OA and OB

TTL with 3-state

Notes:

1. Test Conditions:

VCC = 3.3V ±0.3V, TA = 0°C to 70°C, (unless otherwise stated).
Output loads:

Data bus (D0-D7), address bus (A0-A15), chip selects,
DRD#, and DWR# loads = 70 pF + one TTL load.

Other = 50 pF + one TTL load.

2. Type IE inputs are centered approximately 2.5 V and swing 1.5 V

PEAK

in each direction.

3. Type OE outputs provide oscillator feedback when operating with an external crystal.

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