FOCUS Enhancements FS453 - Manual (Page 39)

FS453/4 AND FS455/6 DATA SHEET: HARDWARE REFERENCE
6°C/sec max.
Max. 220 +5, -0 °C
10sec ±3sec
60~150sec
(Over 183°C)
3°C/sec Max.
140~160°C
60~120sec
3°C/sec Max. Max. 225°C
Cooling down(F) Re-flow peak(E) Maintain(D) Heat-up(C) Pre-heat(B) Heat-up(A) Peak Temp.
IR Re-flow Profile for Pre-conditioning
100
200
300
°C
B
C
D
E (Peak Temperature 220°C +5, -0 °C)
A
F
sec
IR Re IR Re - - flow Profile flow Profile
Figure 16 FBGA Package (Lead Solder)
™ ™ Moisture Absorption Condition : 30 Moisture Absorption Condition : 30 ° C/60%RH, 192hrs C/60%RH, 192hrs
™ ™ IR sequence : Bake IR sequence : Bake - - Absorption Absorption - - IR 3 times IR 3 times
IR Re-flow Profile & Moisture Absorption Condition
100
200
300°C
B
C D
E (Peak Temperature 260°C)
A
F
sec
6°C/sec Max. Max. 260°C
255°C+5, -0°C
10 ±3sec
3°C/sec Max.
160~190°C
90 ±30sec
3°C/sec Max. Max. 260°C
Cooling down(F) Re-flow peak(E) Maintain(D) Heat-up(C) Pre-heat(B) Heat-up(A) Peak Temp.
IR Re-flow Profile for Pre-conditioning
Figure 17 PQFP or FBGA Package (Lead-Free Solder)
JANUARY, 2005, VERSION 3.0 39 COPYRIGHT ©2003-4 FOCUS ENHANCEMENTS, INC.
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