FOCUS Enhancements FS453 - Manual (Page 38)

FS453/4 AND FS455/6 DATA SHEET: HARDWARE REFERENCE
9.6 Solder Re-flow Profiles
The following figures provide solder re-flow profiles for the PQFP and FBGA packages with lead and
lead-free solder options.
6°C/sec max.
Max. 235 +5, -0 °C
10sec +/-3sec
20~60sec
(Over 200°C)
3°C/sec Max.
140~160°C
60~120sec
3°C/sec Max. Max. 240°C
Cooling down(F) Re-flow peak(E) Maintain(D) Heat-up(C) Pre-heat(B) Heat-up(A) Peak Temp.
IR Re-flow Profile for Pre-conditioning
100
200
300
°C
B
C
D
E (Peak Temperature 235°C +5, -0 °C)
A
F
sec
IR Re IR Re - - flow Profile flow Profile
Figure 15 PQFP Package (Lead Solder)
JANUARY, 2005, VERSION 3.0 38 COPYRIGHT ©2003-4 FOCUS ENHANCEMENTS, INC.
FOCUS Enhancements Semiconductor