Freescale Semiconductor Demonstration Board DEMO9S08AC60E - Manual (Page 13)

DEMO9S08AC60E User’s Guide, Rev. 0.1
Freescale Semiconductor 13
1.8.1 Integrated BDM
The DEMO9S08AC60E features an integrated USB-BDM debugger from P&E
Microcomputer Systems. All necessary signals are provided via the integrated
debugger. A USB type B connector (J33) provides the connection between the
DEMO9S08AC60E and your host PC.
The integrated debugger provides the DEMO9S08AC60E with power
eliminating the need to power the board externally. Power is derived from the
USB bus, therefore total current consumption should not exceed 500mA.
Excessive current drain will violate the USB spec and damage to your Host
PC’s USB hub or the DEMO9S08AC60E could occur.
1.8.2 BDM Header
J32 is the stand alone BDM header. Use of this port requires the user to solder
a 2 x 6 100 mil center header on the board. The pinout is as follows:
Table 1-2 BDM Connector (J32) Pinout
BKGD 1 2 GND
NC 3 4 RESET_B
NC 5 6 VDD
1.8.3 Socketed MCU
The MC9S08AC60 silicon is socketed on the DEMO9S08AC60E board. This
socket is an open top, spring actuated, 0.8mm pitch socket. It is made by Wells
Electronics, part number 7314-064-0-08. Before connecting power to the demo
board the silicon should be installed in this socket. Using your thumb and index
finger, press down on the socket until it is fully actuated. Place the silicon in the
socket with a vacuum pen or other chip lifting device. Pin 1 of the silicon
(denoted by an indented dot) should be in the bottom left hand corner, towards
the USB connector J33. Release the socket. The MC9S08AC60 silicon should
be centered within the socket and firmly held in place.