Package outline, Mmic wideband amplifier bga2712 – Philips BGA2712 User Manual

Page 9

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2002 Sep 10

9

NXP Semiconductors

Product specification

MMIC wideband amplifier

BGA2712

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT363

SC-88

w

B

M

bp

D

e1

e

pin 1
index

A

A1

Lp

Q

detail X

HE

E

v

M

A

A

B

y

0

1

2 mm

scale

c

X

1

3

2

4

5

6

Plastic surface-mounted package; 6 leads

SOT363

UNIT

A1

max

bp

c

D

E

e

1

HE

Lp

Q

y

w

v

mm

0.1

0.30
0.20

2.2
1.8

0.25
0.10

1.35
1.15

0.65

e

1.3

2.2
2.0

0.2

0.1

0.2

DIMENSIONS (mm are the original dimensions)

0.45
0.15

0.25
0.15

A

1.1
0.8

04-11-08
06-03-16

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