NXP Semiconductors PiP3209-R - Manual (Page 7)

Philips Semiconductors Product Specification
TOPFET high side switch PIP3209-R
MECHANICAL DATA
Fig.4. SOT426 surface mounting package 1 , centre pin connected to mounting base.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
SOT426
0 2.5 5 mm
scale
Plastic single-ended surface mounted package (Philips version of D 2 -PAK); 5 leads
(one lead cropped) SOT426
e e e e
E
b
A1
A
A1 Lp b c
D
max.
e A UNIT
DIMENSIONS (mm are the original dimensions)
E
11 mm
4.50
4.10 1.40
1.27 0.85
0.60 0.64
0.46 2.90
2.10
HD
15.80
14.80
Q
2.60
2.20 10.30
9.70
D1
1.60
1.20
1.70
98-12-14
99-06-25
1
3
2 4 5
mounting
base
D1
HD
D
Q
Lp
c
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
July 2001 7 Rev 1.000