ZyXEL Communications Multi-service Access Platform MSAP2000 User Manual
Page 167

7. Product Specification
MSAP2000 Technical Manual V3.0
7-60
GSH Specification
Microprocessor Winbond
W90N740
Flash ROM
Flash EPROM(1MB)
Hardware
RAM SRAM
(2MB)
G.SHDSL Interface
Line Code
16 Leel TC PAM (TC PAM 16)
Symbol Rate
Frame
(Data Rate+8000)/3 Symbol/sec
Complies with ITU-T G.991.2
Standards
Test Impedance
135
Ω, Resistance
Handshake Standard
Complies with ITU-T G.991.2
and ITU-T G.994.1 Standards
Loopback Testing
Local
Loopback
Remote
Loopback
Remote Payload Loopback
Input Power
5VDC/1.4A
-48VDC/20mA
(Sealing)
Power
Consumption
4W@25°C
Environment
Operation Temperature and
0°C to +60°C
Humidity
Up to 95% relative humidity
Storage Temperature and
-10°C to +80°C
Humidity
Up to 95% relative humidity
Height
213 ± 1mm
Width
18 ± 1mm
Depth
257 ± 1mm
Dimension
Weight
356 ± 2 g
EMI
CNS 13438 or CISPR 22
ESD
IEC 61000-4-2 Class 1