ZyXEL Communications Multi-service Access Platform MSAP2000 User Manual
Page 191

7. Product Specification
MSAP2000 Technical Manual V3.0
7-84
ETH Specification
Microprocessor Winbond
W90N740
Flash ROM
Flash EPROM(1MB)
Hardware
RAM SRAM
(2MB)
Ethernet Interface
Module Capacity
1 Channels
Connector
Flow Control
Front Access J45 MDI, MDI-X
802.3x flow control
Package Size
Up to 1536 bytes
Max. Transmission Speed
16.384 Mbps
Step Adjustment speed
64 kbps
Package Mapping
HDLC encapsulation (Bit
stuffing)
Input Power
5
VDC/1.2A
Power
Consumption
6W@25°C
Environment
Operation Temperature and
0°C to +60°C
Humidity
Up to 95% relative humidity
Storage Temperature and
-10°C to +80°C
Humidity
Up to 95% relative humidity
Height
213 ± 1mm
Width
18 ± 1mm
Depth
257 ± 1mm
Dimension
Weight
303 ± 2 g
EMI
CNS 13438 or CISPR 22
ESD
IEC 61000-4-2 Class 1