ZyXEL Communications Multi-service Access Platform MSAP2000 User Manual
Page 200
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7. Product Specification
MSAP2000 Technical Manual V3.0
7-93
QEToP Specification
Local Processor
WINBOND W90N740
Flash ROM
Flash EPROM(4MB)
Hardware
RAM SRAM
(32MB)
Insertion Loss
0.25dB
nominal
0.5dB
maximum
Minimum Isolation
16dB
Wavelength
1310nm +/- 20nm
1550nm +/- 20nm
Connector
LC x 3
Input Power
5VDC/3A
Power
Consumption
1.1W@25°C
Environment
Operation Temperature and
0°C to +60°C
Humidity
Up to 95% relative humidity
Storage Temperature and
-10°C to +80°C
Humidity
Up to 95% relative humidity
Height
213 ± 1mm
Width
18 ± 1mm
Depth
257 ± 1mm
Dimension
Weight
470 ± 2 g
EMI
CNS 13438 or CISPR 22
ESD
IEC 61000-4-2 Class 1
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