Chip information, Package information, B3 coefficient (55h) – Rainbow Electronics MAX11043 User Manual

Page 31

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MAX11043

4-Channel, 16-Bit, Simultaneous-Sampling ADCs

with PGA, Filter, and 8-/12-Bit Dual-Stage DAC

______________________________________________________________________________________

31

A2, A3, and B2 Filter Coefficient

Format (52h, 54h, 56h)

Filter coefficients A2, A3, and B2 are stored as 16-bit
two’s complement values in the -4 to (4 - 2

-13

) range.

The transfer function equation is as follows:

A2 = int (N x 2

13

)

where N is the decimal coefficient value.

The following are two examples of the transfer function
equation:

Example 1:

N = 2.381

A2 = int (2.381 x 2

13

)

A2 = int (19505.152)

A2 = 19505 = 4C31h (two’s complement)

Example 2:

N = -2.381

A2 = int (-2.381 x 2

13

)

A2 = int (-19505.152)

A2 = -19505 = B3CFh (two’s complement)

BIT 15

BIT 14

BIT 13

BIT 12

BIT 11

BIT 10

BIT 9

BIT 8

B31

B30

X

RECT

X

X

X

X

B3 Coefficient (55h)

B31:B30<15:14>: Filter coefficient B3.

11 = -1.

00 = 0.

01 = 1.

10 = 0.

X<13>: Don’t-care bit. Not used.

RECT<12>: Rectify bit.

0 = bipolar output.

1 = output rectified. All samples positive.

X<11:0>: Don’t-care bits. Not used.

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

X

X

X

X

X

X

X

X

Power Supplies, Layout, and

Bypassing Considerations

For best performance, use PCBs with ground planes.
Ensure that digital and analog signal lines are separat-
ed from each other. Do not run analog and digital lines
parallel to one another (especially clock lines), and do
not run digital lines underneath the MAX11043 pack-
age. Use a single-point analog ground (star ground
point) at AGND, separate from the logic ground.
Connect all other analog grounds and DGND to this
star ground point. Do not connect other digital system
grounds to this single-point analog ground. The ground
return to the power supply for this ground should be
low impedance and as short as possible for noise-free

operation. Bypass all supplies to ground with high
quality capacitors as close as possible to the device.

Chip Information

PROCESS: BiCMOS

Package Information

For the latest package outline information and land patterns, go
to

www.maxim-ic.com/packages

.

PACKAGE TYPE

PACKAGE CODE

DOCUMENT NO.

40 TQFN

T4066-5

21-0141

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