Chip information, Package information, B3 coefficient (55h) – Rainbow Electronics MAX11043 User Manual
Page 31

MAX11043
4-Channel, 16-Bit, Simultaneous-Sampling ADCs
with PGA, Filter, and 8-/12-Bit Dual-Stage DAC
______________________________________________________________________________________
31
A2, A3, and B2 Filter Coefficient
Format (52h, 54h, 56h)
Filter coefficients A2, A3, and B2 are stored as 16-bit
two’s complement values in the -4 to (4 - 2
-13
) range.
The transfer function equation is as follows:
A2 = int (N x 2
13
)
where N is the decimal coefficient value.
The following are two examples of the transfer function
equation:
Example 1:
N = 2.381
A2 = int (2.381 x 2
13
)
A2 = int (19505.152)
A2 = 19505 = 4C31h (two’s complement)
Example 2:
N = -2.381
A2 = int (-2.381 x 2
13
)
A2 = int (-19505.152)
A2 = -19505 = B3CFh (two’s complement)
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
B31
B30
X
RECT
X
X
X
X
B3 Coefficient (55h)
B31:B30<15:14>: Filter coefficient B3.
11 = -1.
00 = 0.
01 = 1.
10 = 0.
X<13>: Don’t-care bit. Not used.
RECT<12>: Rectify bit.
0 = bipolar output.
1 = output rectified. All samples positive.
X<11:0>: Don’t-care bits. Not used.
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
X
X
X
X
X
X
X
X
Power Supplies, Layout, and
Bypassing Considerations
For best performance, use PCBs with ground planes.
Ensure that digital and analog signal lines are separat-
ed from each other. Do not run analog and digital lines
parallel to one another (especially clock lines), and do
not run digital lines underneath the MAX11043 pack-
age. Use a single-point analog ground (star ground
point) at AGND, separate from the logic ground.
Connect all other analog grounds and DGND to this
star ground point. Do not connect other digital system
grounds to this single-point analog ground. The ground
return to the power supply for this ground should be
low impedance and as short as possible for noise-free
operation. Bypass all supplies to ground with high
quality capacitors as close as possible to the device.
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns, go
to
www.maxim-ic.com/packages
.
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
40 TQFN
T4066-5
21-0141