Zxmn6a11g, Maximum ratings, Thermal characteristics – Diodes ZXMN6A11G User Manual

Page 2

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ZXMN6A11G

Document number: DS33556 Rev. 5 - 2

2 of 8

www.diodes.com

October 2010

© Diodes Incorporated

ZXMN6A11G

A Product Line of

Diodes Incorporated







Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

60

V

Gate-Source Voltage

V

GS

±20

Continuous Drain Current

V

GS

= 10V

(Note 3)
T

A

= 70°C (Note 3)

(Note 2)

I

D

4.4

3.5
3.1

A

Pulsed Drain Current

V

GS

= 10V

(Note 4)

I

DM

15.6

Continuous Source Current (Body Diode)

(Note 3)

I

S

5

Pulsed Source Current (Body Diode)

(Note 4)

I

SM

15.6



Thermal Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Unit

Power Dissipation
Linear Derating Factor

(Note 2)

P

D

2.0

16

W

mW/°C

(Note 3)

3.9

31

Thermal Resistance, Junction to Ambient

(Note 2)

R

θJA

62.5

°C/W

(Note 3)

32.0

Thermal Resistance, Junction to Lead

(Note 5)

R

θJL

9.8

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C

Notes: 2.

For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is

measured when operating in a steady-state condition.
3. Same as note (2), except the device is measured at t

≤ 10 sec.

4. Same as note (2), except the device is pulsed with D = 0.02 and pulse width 300

μs.

5. Thermal resistance from junction to solder-point (at the end of the drain lead).





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