Zxmc3a17dn8, Advance information – Diodes ZXMC3A17DN8 User Manual

Page 4

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ZXMC3A17DN8

S E M I C O N D U C T O R S

ISSUE 1 - OCTOBER 2005

ADVANCE INFORMATION

4

PARAMETER

SYMBOL

MIN.

TYP.

MAX.

UNIT

CONDITIONS

STATIC

Drain-Source Breakdown
Voltage

V

(BR)DSS

30

V

I

D

= 250

␮A, V

GS

=0V

Zero Gate Voltage Drain
Current

I

DSS

0.5

␮A

V

DS

=30V, V

GS

=0V

Gate-Body Leakage

I

GSS

100

nA

V

GS

=±20V, V

DS

=0V

Gate-Source Threshold
Voltage

V

GS(th)

1.0

V

I

D

= 250

␮A, V

DS

=V

GS

Static Drain-Source On-State

Resistance

(1)

R

DS(on)

0.050

0.065


V

GS

= 10V, I

D

= 7.8A

V

GS

= 4.5V, I

D

= 6.8A

Forward

Transconductance

(1) (3)

g

fs

10

S

V

DS

= 10V, I

D

= 7.8A

DYNAMIC

(3)

Input Capacitance

C

iss

600

pF

V

DS

= 25V, V

GS

=0V

f=1MHz

Output Capacitance

C

oss

104

pF

Reverse Transfer Capacitance

C

rss

58.5

pF

SWITCHING

(2) (3)

Turn-On-Delay Time

t

d(on)

2.9

ns

V

DD

= 15V, I

D

=3.5A

R

G

≅ 6.0⍀,

V

GS

= 10V

Rise Time

t

r

6.4

ns

Turn-Off Delay Time

t

d(off)

16

ns

Fall Time

t

f

11.2

ns

Gate Charge

Q

g

6.9

nC

V

DS

= 15V, V

GS

= 5V

I

D

= 3.5A

Total Gate Charge

Q

g

12.2

nC

V

DS

= 15V, V

GS

= 10V

I

D

= 3.5A

Gate-Source Charge

Q

gs

1.7

nC

Gate-Drain Charge

Q

gd

2.4

nC

SOURCE-DRAIN DIODE

Diode Forward Voltage

(1)

V

SD

0.85

0.95

V

T

j

=25°C, I

S

= 3.2A,

V

GS

=0V

Reverse Recovery Time

(3)

t

rr

18.8

ns

T

j

=25°C, I

F

= 3.5A,

di/dt=100A/

␮s

Reverse Recovery Charge

(3)

Q

rr

14.1

nC

N-CHANNEL
ELECTRICAL CHARACTERISTICS
(at T

amb

= 25°C unless otherwise stated)

(1)

Measured under pulsed conditions. Pulse width

Յ 300ms; Duty cycle Յ 2%.

(2)

Switching characteristics are independent of operating junction temperature.

(3)

For design aid only, not subject to production testing.

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