Diodes ZXMHC10A07N8 - Manual (Page 4)

ZXMHC10A07N8
Issue 1.0 - March 2009 4
© Diodes Incorporated
www.diodes.com
N-channel electrical characteristics (at T
amb
= 25°C unless otherwise stated)
Parameter Symbol Min. Typ. Max. Unit Conditions
Static
Drain-Source breakdown
voltage
V
(BR)DSS
100 V I
D
= 250
μA, V
GS
= 0V
Zero Gate voltage Drain
current
I
DSS
0.5 µA V
DS
= 100V, V
GS
= 0V
Gate-Body leakage I
GSS
±
100 nA V
GS
=
±20V, V
DS
= 0V
Gate-Source threshold
voltage
V
GS(th)
2.0 4.0 V I
D
= 250
μA, V
DS
= V
GS
Static Drain-Source
on-state resistance
(a) R
DS(on)
0.7
0.9
Ω
V
GS
= 10V, I
D
= 1.5A
V
GS
= 6.0V, I
D
= 1.0A
Forward
Transconductance
(a) (c) g
fs
1.6 S V
DS
= 15V, I
D
= 1.0A
Dynamic
Capacitance
(c)
Input capacitance C
iss
138 pF
V
DS
= 60V, V
GS
= 0V
f= 1MHz
Output capacitance C
oss
12 pF
Reverse transfer
capacitance
C
rss
6 pF
Switching
(b) (c)
Turn-on-delay time t
d(on)
1.8 ns
V
DD
= 50V, V
GS
= 10V
I
D
= 1.0A
R
G
≅ 6.0Ω,
Rise time t
r
1.5 ns
Turn-off delay time t
d(off)
4.1 ns
Fall time t
f
2.1 ns
Gate charge
(c)
Total Gate charge Q
g
2.9 nC
V
DS
=50V, V
GS
= 10V
I
D
= 1.0A
Gate-Source charge Q
gs
0.7 nC
Gate-Drain charge Q
gd
1.0 nC
Source–Drain diode
Diode forward voltage
(a)
V
SD
0.95 V I
S
= 1.5A, V
GS
= 0V
Reverse recovery time
(c)
t
rr
27 ns
I
S
= 1.8A, di/dt= 100A/
μs
Reverse recovery charge
(c)
Q
rr
12 nC
NOTES:
(a) Measured under pulsed conditions. Pulse width
≤ 300μs; duty cycle ≤ 2%.
(b) Switching characteristics are independent of operating junction temperature.
(c) For design aid only, not subject to production testing