Package outline dimensions, Suggested pad layout, Dmg5802lfx – Diodes DMG5802LFX User Manual

Page 5

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DMG5802LFX

Document number: DS35009 Rev. 5 - 2

5 of 6

www.diodes.com

November 2013

© Diodes Incorporated

DMG5802LFX


Package Outline Dimensions

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.





















Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
















0.001

0.01

0.1

1

10

100

1,000

Fig. 13 Transient Thermal Response

t , PULSE DURATION TIME (s)

1

0.00001

0.0001

0.001

0.01

0.1

1

r(t

),

T

R

ANS

IEN

T

T

H

E

R

MA

L

R

ES

IS

TAN

C

E

T - T = P * R

(t)

Duty Cycle, D = t /t

J

A

JA

1 2

R

(t) = r(t) *

JA

R

R

= 122°C/W

JA

JA

P(pk)

t

1

t

2

D = 0.7

D = 0.3

D = 0.1

D = 0.05

D = 0.02

D = 0.01

D = 0.005

D = Single Pulse

D = 0.9

D = 0.5

W-DFN5020-6

Dim

Min

Max Typ

A

0.75

0.85 0.80

A1

0 0.05

0.02

A3





0.15

b

0.20

0.30 0.25

D

1.90

2.10 2.00

D2

1.40 1.60 1.50

e





0.50

E

4.90 5.10 5.00

E2

2.80 3.00 2.90

L

0.35 0.65 0.50

Z





0.375

All Dimensions in mm

Dimensions Value (in mm)

C

0.50

G

0.35

X

0.35

X1

0.90

X2

1.80

Y

0.70

Y2

1.60

Y3

3.20

e

D

A3

A1

A

E

D2

E2

L

Z

b

Pin 1 ID

Y3

X2

X1

Y2

X

C

Y

G

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