Package outline dimensions, Suggested pad layout – Diodes DMN2501UFB4 User Manual

Page 5

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DMN2501UFB4

Document number: DS35824 Rev. 3 - 2

5 of 6

www.diodes.com

August 2012

© Diodes Incorporated

DMN2501UFB4

ADVAN

CE I

N

F

O

RM

ATI

O

N



0.00001

0.0001

0.001

0.01

0.1

1

10

100

1,000

t1, PULSE DURATION TIME (sec)

Fig. 13 Transient Thermal Resistance

R

(t) = r(t) * R

R

= 251°C/W

Duty Cycle, D = t1/ t2

θ

θ

θ

JA

JA

JA

0.001

0.01

0.1

1

r(

t),

T

R

A

N

SI

EN

T

T

H

E

R

MA

L

R

ES

IS

T

AN

C

E

D = 0.5

D = 0.7

D = 0.9

D = 0.3

D = 0.1

D = 0.05

D = 0.02

D = 0.01

D = 0.005

D = Single Pulse



Package Outline Dimensions

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.






















Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

















X2-DFN1006-3

Dim

Min

Max Typ

A

0.40

A1

0

0.05 0.03

b1

0.10

0.20 0.15

b2

0.45

0.55 0.50

D

0.95

1.05 1.00

E

0.55

0.65 0.60

e

0.35

L1

0.20

0.30 0.25

L2

0.20

0.30 0.25

L3

0.40

All Dimensions in mm

Dimensions

Value (in mm)

Z

1.1

G1

0.3

G2

0.2

X

0.7

X1

0.25

Y

0.4

C

0.7

Y

C

G1

G2

X

X

1

Z

L2

A1

E

b2

L1

L3

D

e

b1

A

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