Dmn4800lss new prod uc t, Maximum ratings, Thermal characteristics – Diodes DMN4800LSS User Manual

Page 2: Electrical characteristics, Dmn4800lss

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DMN4800LSS

Document number: DS31736 Rev. 7 - 2

2 of 6

www.diodes.com

October 2013

© Diodes Incorporated

DMN4800LSS

NEW PROD

UC

T



Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

30 V

Gate-Source Voltage

V

GSS

25

V

Continuous Drain Current (Note 6) V

GS

= 10V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

8.6
6.3

A

t<10s

T

A

= +25°C

T

A

= +70°C

I

D

11.8

9.0

A

Maximum Body Diode Forward Current (Note 6)

I

S

2.4 A

Pulsed Drain Current (Note 7)

I

DM

50 A



Thermal Characteristics

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 5)

T

A

= +25°C

P

D

1.46

W

T

A

= +70°C

0.9

Thermal Resistance, Junction to Ambient (Note 5)

Steady state

R

JA

86

°C/W

t<10s 46

Total Power Dissipation (Note 6)

T

A

= +25°C

P

D

1.7

W

T

A

= +70°C

1.0

Thermal Resistance, Junction to Ambient (Note 6)

Steady state

R

JA

75

°C/W

t<10s 40

Thermal Resistance, Junction to Case (Note 6)

R

JC

15

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C


Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage

BV

DSS

30

V

V

GS

= 0V, I

D

= 250μA

Zero Gate Voltage Drain Current

I

DSS

1

μA

V

DS

= 30V, V

GS

= 0V

Gate-Source Leakage

I

GSS

100

nA

V

GS

=

20V, V

DS

= 0V

ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage

V

GS(th)

0.8 1.2

1.6 V

V

DS

= V

GS

, I

D

= 250μA

Static Drain-Source On-Resistance

R

DS (ON)

11
14

14
20

mΩ

V

GS

= 10V, I

D

= 9A

V

GS

= 4.5V, I

D

= 7A

Forward Transconductance

g

fs

8

S

V

DS

= 10V, I

D

= 9A

Diode Forward Voltage (Note 8)

V

SD

0.72 0.94 V

V

GS

= 0V, I

S

= 1A

DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance

C

iss

798

pF

V

DS

= 10V, V

GS

= 0V

f = 1.0MHz

Output Capacitance

C

oss

128

pF

Reverse Transfer Capacitance

C

rss

122

pF

Gate Resistance

R

G



1.37



V

DS

= 0V, V

GS

= 0V, f = 1.0MHz

Total Gate Charge

Q

g



8.7



nC

V

GS

= 5V, V

DS

= 15V, I

D

= 9A

Gate-Source Charge

Q

gs



1.7



Gate-Drain Charge

Q

gd



2.4



Turn-On Delay Time

t

d(on)



5.03



ns

V

DD

= 15V, V

GEN

= 10V,

R

L

= 15Ω

R

G

= 6.0Ω

I

D

= 1A

Rise Time

t

r



4.50



Turn-Off Delay Time

t

d(off)



26.33



Fall Time

t

f



8.55



Notes:

5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.

6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout

7. Repetitive rating, pulse width limited by junction temperature.

8. Short duration pulse test used to minimize self-heating effect.

9. Guaranteed by design. Not subject to product testing.


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