Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMN5/L06VK/L06VAK/010VAK User Manual

Page 2

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DMN5/L06VK/L06VAK/010VAK

Document number: DS30769 Rev. 11 - 2

2 of 6

www.diodes.com

May 2014

© Diodes Incorporated

DMN5/L06VK/L06VAK/010VAK



Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Unit

Drain Source Voltage

V

DSS

50 V

Drain-Gate Voltage R

GS

≤ 1.0MΩ

V

DGR

50 V

Gate-Source Voltage

Continuous

Pulsed

V

GSS

±20
±40

V

Drain Current (Note 6)

Continuous

Pulsed

I

D

I

DM

280

1.5

mA

A



Thermal Characteristics

Characteristic Symbol

Value

Unit

Total Power Dissipation (Note 6)

P

D

250 mW

Thermal Resistance, Junction to Ambient (Note 6)

R

θJA

500

°C/W

Operating and Storage Temperature Range

T

J

, T

STG

-55 to +150

°C



Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage

BV

DSS

50

— — V

V

GS

= 0V, I

D

= 10µA

Zero Gate Voltage Drain Current

@ T

C

= +25°C

I

DSS

— — 60 nA

V

DS

= 50V, V

GS

= 0V

Gate-Body Leakage

I

GSS

— —

1

500

50

µA
nA
nA

V

GS

= ±12V, V

DS

= 0V

V

GS

= ±10V, V

DS

= 0V

V

GS

= ±5V, V

DS

= 0V

ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage @T

J

= +25°C

@T

J

= +0°C~ +85°C (Note 8)

V

GS(th)

0.49
0.30

1.0
1.2

V

V

DS

= V

GS

, I

D

= 250µA

Static Drain-Source On-Resistance

R

DS (ON)





3.0
2.5
2.0

V

GS

= 1.8V, I

D

= 50mA

V

GS

= 2.5V, I

D

= 50mA

V

GS

= 5.0V, I

D

= 50mA

On-State Drain Current

I

D(ON)

0.5 1.4 —

A

V

GS

= 10V, V

DS

= 7.5V

Forward Transconductance

|Y

fs

|

200

— — mS

V

DS

=10V, I

D

= 0.2A

Source-Drain Diode Forward Voltage

V

SD

0.5

1.4 V

V

GS

= 0V, I

S

= 115mA

DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance

C

iss

— — 50 pF

V

DS

= 25V, V

GS

= 0V

f = 1.0MHz

Output Capacitance

C

oss

— — 25 pF

Reverse Transfer Capacitance

C

rss

— — 5.0 pF

Notes:

6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
















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