Dmn62d0sfd new prod uc t, Maximum ratings, Thermal characteristics – Diodes DMN62D0SFD User Manual

Page 2: Electrical characteristics, Dmn62d0sfd

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DMN62D0SFD

Document number: DS35473 Rev. 3 - 2

2 of 6

www.diodes.com

January 2012

© Diodes Incorporated

DMN62D0SFD

NEW PROD

UC

T



Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

60 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 5) V

GS

= 10V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

540
430

mA

t<10s

T

A

= 25°C

T

A

= 70°C

I

D

630
500

mA

Continuous Drain Current (Note 5) V

GS

= 5V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

430
340

mA

t<10s

T

A

= 25°C

T

A

= 70°C

I

D

510
410

mA

Pulsed Drain Current (10

μs pulse, duty cycle = 1%)

I

DM

1.0 A

Maximum Body Diode Forward Current (Note 5)

I

S

1.0 A


Thermal Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 4)

P

D

0.43 W

Thermal Resistance, Junction to Ambient (Note 4)

Steady state

R

θJA

260 °C/W

t<10s 182

°C/W

Total Power Dissipation (Note 5)

P

D

0.89 W

Thermal Resistance, Junction to Ambient (Note 5)

Steady state

R

θJA

140 °C/W

t<10s 98

°C/W

Thermal Resistance, Junction to Case (Note 5)

R

θJC

112 °C/W

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C


Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

BV

DSS

60 - - V

V

GS

= 0V, I

D

= 10

μA

Zero Gate Voltage Drain Current T

J

= 25°C

I

DSS

- -

100

nA

V

DS

= 60V, V

GS

= 0V

Gate-Source Leakage

I

GSS

- - 10

μA

V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage

V

GS(th)

1.0 1.6 2.5 V

V

DS

= 10V, I

D

= 1mA

Static Drain-Source On-Resistance

R

DS (ON)

- - 2 Ω

V

GS

= 10V, I

D

= 500mA

- - 3

V

GS

= 5V, I

D

= 50mA

Forward Transfer Admittance

|Y

fs

|

- 130 - mS

V

DS

= 3V, I

D

= 30mA

Diode Forward Voltage

V

SD

- 0.8

1.2 V

V

GS

= 0V, I

S

= 300mA

DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance

C

iss

- 30.2 - pF

V

DS

= 25V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

- 4.4 - pF

Reverse Transfer Capacitance

C

rss

- 2.8 - pF

Gate Resistance

R

g

- 131 -

Ω

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge (V

GS

= 4.5V)

Q

g

- 0.39 - nC

V

DS

= 10V, I

D

= 1A

Total Gate Charge (V

GS

= 10.0V)

Q

g

- 0.87 - nC

Gate-Source Charge

Q

gs

- 0.14 - nC

Gate-Drain Charge

Q

gd

- 0.09 - nC

Turn-On Delay Time

t

D(on)

- 3.95 - ns

V

DS

= 30V, I

D

= 200mA

V

GS

= 10V, R

G

= 25Ω

Turn-On Rise Time

t

r

- 3.81 - ns

Turn-Off Delay Time

t

D(off)

- 16.0 - ns

Turn-Off Fall Time

t

f

- 9.04 - ns

Notes:

4. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate
6 .Short duration pulse test used to minimize self-heating effect.

7. Guaranteed by design. Not subject to production testing.


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