Package outline dimensions, Suggested pad layout – Diodes DMG3407SSN User Manual
Page 5
DMG3407SSN
Document number: DS35135 Rev. 5 - 2
5 of 6
April 2012
© Diodes Incorporated
DMG3407SSN
ADVAN
CE I
N
F
O
RM
ATI
O
N
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIMES (sec)
Fig. 13 Transient Thermal Resistance
0.001
0.01
0.1
r(t),
T
R
ANSI
E
N
T
T
H
E
R
MA
L
R
ES
IS
T
AN
C
E
1
R
(t) = r(t) * R
θ
θ
JA
JA
R
= 164°C/W
Duty Cycle, D = t1/ t2
θJA
D = 0.7
D = 0.9
D = 0.5
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
Single Pulse
Package Outline Dimensions
Suggested Pad Layout
SC59
Dim Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D
- -
0.95
G
- -
1.90
H
2.90 3.10 3.00
J
0.013
0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
N
0.70 0.80 0.75
α
0° 8° -
All Dimensions in mm
Dimensions
Value (in mm)
Z
3.4
X
0.8
Y
1.0
C
2.4
E
1.35
A
M
J
L
D
B C
H
K
G
N
X
E
Y
C
Z