Maximum ratings, Thermal characteristics, Electrical characteristics q1 n-channel – Diodes DMC1030UFDB User Manual

Page 2: Dmc1030ufdb

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DMC1030UFDB

Document number: DS36933 Rev.1 - 2

2 of 9

www.diodes.com

April 2014

© Diodes Incorporated

DMC1030UFDB



Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Q1

N-CHANNEL

Q2

P-CHANNEL

Units

Drain-Source Voltage

V

DSS

12 -12

V

Gate-Source Voltage

V

GSS

±8 ±8

V

Continuous Drain Current (Note 5) V

GS

= 4.5V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

5.1
4.1

-3.9
-3.1

A

t < 5s

T

A

= +25°C

T

A

= +70°C

I

D

6.6
5.3

-5.0
-4.0

A

Maximum Continuous Body Diode Forward Current (Note 5)

I

S

2

-1.7

A

Pulsed Drain Current (10µs pulse, duty cycle = 1%)

I

DM

35 -25

A



Thermal Characteristics

Characteristic Symbol

Value Units

Total Power Dissipation (Note 5)

Steady State

P

D

1.36

W

t < 5s

1.89

Thermal Resistance, Junction to Ambient (Note 5)

Steady State

R

θJA

92

°C/W

t < 5s

66

Thermal Resistance, Junction to Case (Note 5)

R

θJC

18

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C



Electrical Characteristics Q1 N-CHANNEL

(@ T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

BV

DSS

12

— V

V

GS

= 0V, I

D

= 250μA

Zero Gate Voltage Drain Current T

J

= +25°C

I

DSS

1.0

μA

V

DS

= 12V, V

GS

= 0V

Gate-Source Leakage

I

GSS

±10

μA

V

GS

= ±8V, V

DS

= 0V

ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage

V

GS(th)

0.4 — 1 V

V

DS

= V

GS

, I

D

= 250μA

Static Drain-Source On-Resistance

R

DS(ON)

17 34

mΩ

V

GS

= 4.5V, I

D

= 4.6A

20 40

V

GS

= 2.5V, I

D

= 4.2A

24 50

V

GS

= 1.8V, I

D

= 3.8A

28 70

V

GS

= 1.5V, I

D

= 1.5A

Diode Forward Voltage

V

SD

0.7 1.2 V

V

GS

= 0V, I

S

= 4.8A

DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance

C

iss

1003

pF

V

DS

= 6V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

132

pF

Reverse Transfer Capacitance

C

rss

115

pF

Gate Resistance

R

g

11.3

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge (V

GS

= 4.5V)

Q

g

12.2

nC

V

DS

= 10V, I

D

= 6.8A

Total Gate Charge (V

GS

= 8V)

23.1

nC

Gate-Source Charge

Q

gs

1.3

nC

Gate-Drain Charge

Q

gd

1.5

nC

Turn-On Delay Time

t

D(on)

4.4

ns

V

DD

= 6V, V

GS

= 4.5V,

R

L

= 1.1Ω, R

G

= 1Ω

Turn-On Rise Time

t

r

7.4

ns

Turn-Off Delay Time

t

D(off)

18.8

ns

Turn-Off Fall Time

t

f

4.9

ns

Body Diode Reverse Recovery Time

trr

7.6

nS

I

S

= 5.4A, dI/dt = 100A/μs

Body Diode Reverse Recovery Charge

Qrr

0.9

nC

I

S

= 5.4A, dI/dt = 100A/μs

Notes:

5. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided.

6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.

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