Dmc2038lvt new prod uc t, Maximum ratings n-channel – q1, Maximum ratings p-channel – q2 – Diodes DMC2038LVT User Manual
Page 2: Thermal characteristics
DMC2038LVT
Document number: DS35417 Rev. 6 - 2
2 of 10
September 2013
© Diodes Incorporated
DMC2038LVT
NEW PROD
UC
T
Maximum Ratings N-CHANNEL – Q1
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
20 V
Gate-Source Voltage
V
GSS
±12 V
Continuous Drain Current (Note 5) V
GS
= 4.5V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
3.7
3.0
A
t<10s
T
A
= +25°C
T
A
= +70°C
I
D
4.1
3.2
A
Continuous Drain Current (Note 6) V
GS
= 4.5V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
4.5
3.6
A
t<10s
T
A
= +25°C
T
A
= +70°C
I
D
5.2
4.2
A
Maximum Continuous Body Diode Forward Current (Note 6)
I
S
1.5 A
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
I
DM
25 A
Maximum Ratings P-CHANNEL – Q2
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
-20 V
Gate-Source Voltage
V
GSS
±12 V
Continuous Drain Current (Note 5) V
GS
= -4.5V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-2.6
-2.1
A
t<10s
T
A
= +25°C
T
A
= +70°C
I
D
-2.9
-2.4
A
Continuous Drain Current (Note 6) V
GS
= -4.5V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-3.1
-2.5
A
t<10s
T
A
= +25°C
T
A
= +70°C
I
D
-3.8
-3.0
A
Maximum Continuous Body Diode Forward Current (Note 6)
I
S
-1.5 A
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
I
DM
-17 A
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Total Power Dissipation (Note 5)
T
A
= +25°C
P
D
0.8
W
T
A
= +70°C
0.5
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
R
JA
168
°C/W
t<10s 120
Total Power Dissipation (Note 6)
T
A
= +25°C
P
D
1.1
W
T
A
= +70°C
0.7
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
R
θJA
114
°C/W
t<10s 72
Thermal Resistance, Junction to Case (Note 6)
R
θJC
39
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.