Maximum ratings – q1, Maximum ratings – q2, Thermal characteristics – Diodes DMG6602SVT User Manual

Page 2

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DMG6602SVT

Document number: DS35106 Rev. 6 - 2

2 of 10

www.diodes.com

May 2012

© Diodes Incorporated

DMG6602SVT

ADVAN

CE I

N

F

O

RM

ATI

O

N



Maximum Ratings – Q1

@TA = 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

V

DSS

30 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 5) V

GS

= 10V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

3.4
2.7

A

Continuous Drain Current (Note 5) V

GS

= 4.5V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

2.7
2.2

A

Maximum Continuous Body Diode Forward Current (Note 5)

I

S

1.5 A

Pulsed Drain Current (Note 5)

I

DM

25 A



Maximum Ratings – Q2

@TA = 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

V

DSS

-30 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 5) V

GS

= -10V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

-2.8
-2.4

A

Continuous Drain Current (Note 5) V

GS

= -4.5V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

-2.3
-2.1

A

Maximum Continuous Body Diode Forward Current (Note 5)

I

S

-1.5 A

Pulsed Drain Current (Note 5)

I

D

-20 A



Thermal Characteristics

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 4)

T

A

= 25°C

P

D

0.84

W

T

A

= 70°C

0.52

Thermal Resistance, Junction to Ambient (Note 4)

Steady state

R

θJA

155

°C/W

t<10s 109

Total Power Dissipation (Note 5)

T

A

= 25°C

P

D

1.27

W

T

A

= 70°C

0.8

Thermal Resistance, Junction to Ambient (Note 5)

Steady state

R

θJA

102

°C/W

t<10s 71

Thermal Resistance, Junction to Case (Note 5)

R

θJC

34

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C

Notes:

4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.

















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