Package outline dimensions, Suggested pad layout – Diodes DMC4029SSD User Manual
Page 7
DMC4029SSD
Document number: DS36350 Rev. 3 - 2
7 of 8
March 2014
© Diodes Incorporated
DMC4029SSD
ADVAN
CE I
N
F
O
RM
ATI
O
N
NEW PROD
UC
T
Package Outline Dimensions
rsion.
Suggested Pad Layout
rsion.
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIMES (sec)
Figure 9 Transient Thermal Resistance
r(
t)
, TRA
N
SI
EN
T
THE
R
M
A
L RE
SI
ST
A
NCE
D = 0.7
D = 0.9
D = 0.5
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
Single Pulse
SO-8
Dim
Min
Max
A
-
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
- 0.35
L
0.62 0.82
θ
0
°
8
°
All Dimensions in mm
Dimensions Value (in mm)
X
0.60
Y
1.55
C1
5.4
C2
1.27
Gauge Plane
Seating Plane
Detail ‘A’
Detail ‘A’
E
E1
h
L
D
e
b
A2
A1
A
45
°
7
°~
9
°
A3
0.
2
54
X
C1
C2
Y