Typical characteristics – Diodes LMN200B01 User Manual

Page 4

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DS30651 Rev. 7 - 2

4 of 10

LMN200B01

www.diodes.com

T

C

U

D

O

R

P
W

E

N

Electrical Characteristics:

N-MOSFET with Gate Pull-Down Resistor (Q2)

@ T

A

= 25

°

C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 4)

Drain-Source Breakdown Voltage, BVDSS

V

(BR)DSS

60

V

V

GS

= 0V, I

D

= 10

µ

A

Zero Gate Voltage Drain Current (Drain Leakage
Current)

I

DSS

1

µ

A

V

GS

=0V, V

DS

= 60V

Gate-Body Leakage Current, Forward

I

GSSF

0.95

mA

V

GS

= 20V, V

DS

= 0V

Gate-Body Leakage Current, Reverse

I

GSSR

-0.95

mA

V

GS

= -20V, V

DS

= 0V

ON CHARACTERISTICS (Note 4)

Gate Source Threshold Voltage (Control Supply
Voltage)

V

GS(th)

1

1.86

2.2

V

V

DS

= V

GS

, I

D

= 0.25mA

Static Drain-Source On-State Voltage

V

DS(on)

0.08

1.5

V

V

GS

= 5V, I

D

= 50mA

0.15

3.75

V

GS

= 10V, I

D

= 115mA

On-State Drain Current

I

D(on)

500

mA

V

GS

= 10V,

V

DS

2 V

DS(ON)

Static Drain-Source On Resistance

R

DS(on)

1.55

3

V

GS

= 5V, I

D

= 50mA

1.4

2

V

GS

= 10V, I

D

= 500mA

Forward Transconductance

g

FS

80

240

mS

V

DS

2 V

DS(ON)

, I

D

= 115 mA

80

350

V

DS

2 V

DS(ON)

, I

D

= 200 mA

Gate Pull-Down Resistor, +/- 30%

R3

37

K

DYNAMIC CHARACTERISTICS

Input Capacitance

C

iss

50

pF

V

DS

= -25V, V

GS

= 0V,

ƒ

= 1MHz

Output Capacitance

C

oss

25

pF

Reverse Transfer Capacitance

C

rss

5

pF

SWITCHING CHARACTERISTICS*

Turn-On Delay Time

td

(on)

20

ns

V

DD

= 30V, V

GS

=10V,

I

D

= 200mA,

R

G

= 25

, R

L

= 150

Turn-Off Delay Time

td

(off)

40

ns

SOURCE-DRAIN (BODY) DIODE CHARACTERISTICS AND MAXIMUM RATINGS

Drain-Source Diode Forward On-Voltage

V

SD

0.88

1.5

V

V

GS

= 0V, I

S

= 115 mA*

Maximum Continuous Drain-Source Diode Forward
Current (Reverse Drain Current)

I

S

115

mA

Maximum Pulsed Drain-Source Diode Forward
Current

I

SM

800

mA

Typical Characteristics

0

50

25

50

75

100

125

150

175

P

,

P

O

W

E

R

D

IS

S

IP

A

T

IO

N

(

m

W

)

D

T , AMBIENT TEMPERATURE (°C)

A

Fig. 3, Max Power Dissipation vs Ambient Temperature

100

150

300

350

200

250

0

* Pulse Test: Pulse width, tp<300

µ

S, Duty Cycle, d<=0.02.

Notes: 4. Short duration test pulse used to minimize self-heating effect.

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