Package outline dimensions, Suggested pad layout, Zxtp2013g – Diodes ZXTP2013G User Manual

Page 6

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ZXTP2013G
Da

tasheet Number: DS33714 Rev. 2 - 2

6 of 7

www.diodes.com

May 2013

© Diodes Incorporated

ZXTP2013G

A Product Line of

Diodes Incorporated



Package Outline Dimensions

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.























Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.



















For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between device
terminals and PCB tracking.

















SOT223

Dim

Min

Max

Typ

A

1.55

1.65

1.60

A1

0.010 0.15

0.05

b1

2.90

3.10

3.00

b2

0.60

0.80

0.70

C

0.20

0.30

0.25

D

6.45

6.55

6.50

E

3.45

3.55

3.50

E1

6.90

7.10

7.00

e

4.60

e1

2.30

L

0.85

1.05

0.95

Q

0.84

0.94

0.89

All Dimensions in mm

Dimensions Value (in mm)

X1

3.3

X2

1.2

Y1

1.6

Y2

1.6

C1

6.4

C2

2.3

A1

A

X2

C1

C2

X1

Y2

Y1

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