Teledyne LeCroy WaveLink Differential Probe Series (8-13 GHz) - Manual (Page 15)

Operator's Manual
Differential Amplifier Small Tip Module Dxx30.
Solder-in Interconnect Leads
The probe lead provides ability to access the signal on the device under test (DUT) without
disturbing the operation of the DUT. The solder-in probe lead provides the highest possible
performance at the expense of a non-movable installation. The design of the solder-in lead
minimizes customer circuit loading with the probe connected by providing high probe AC loading
and a wide frequency range where AC circuit loading is minimized.
The solder-in lead supplied with the kit consists of two small, pre-installed and pre-trimmed
attenuating (damping) resistors connected to a flexible transmission line terminating in a connector
mating with the amplifier. Because resistors and resistor lengths are small, this solder-in lead
provides the maximum signal fidelity and minimum circuit loading at the highest frequencies. The
resistors are soldered directly into the connection points of the circuit under test, providing a
reliable, intermittence-free connection.
Five replacement damping resistors are provided with each solder-in lead. Resistors may be
replaced in the field if the tip is damaged. See "Replacing Damping Resistors on the Solder-in
Interconnect Lead" on page 31 for more information.
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