Cirrus Logic CS35L03 - Manual (Page 2)

CS35L01/03
2 DS909F1
TABLE OF CONTENTS
1. BALL DESCRIPTIONS FOR CS35L01 & CS35L03 .............................................................................. 5
2. DIGITAL BALL CONFIGURATIONS ..................................................................................................... 6
3. TYPICAL CONNECTION DIAGRAMS ................................................................................................... 7
4. CHARACTERISTICS & SPECIFICATIONS ........................................................................................... 8
5. APPLICATIONS ................................................................................................................................... 15
5.1 MODE Descriptions ....................................................................................................................... 15
5.2 Reducing the Gain with External Series Resistors ........................................................................ 16
5.3 Output Filtering with the CS35L01/03 ............................................................................................ 17
5.4 Power-Up and Power-Down .......................................................................................................... 19
5.5 Over Temperature Protection ........................................................................................................ 20
6. TYPICAL PERFORMANCE PLOTS ..................................................................................................... 21
6.1 SD Mode Typical Performance Plots ............................................................................................. 21
6.2 FSD Mode Typical Performance Plots ........................................................................................... 23
6.3 HD Mode Typical Performance Plots ............................................................................................. 25
6.4 FHD Mode Typical Performance Plots ........................................................................................... 27
7. PARAMETER DEFINITIONS ................................................................................................................ 29
8. PACKAGING AND THERMAL INFORMATION .................................................................................. 30
8.1 Package Drawings and Dimensions (Note 20) .............................................................................. 30
8.2 Recommend PCB Footprint and Routing Configuration ................................................................ 31
8.3 Package Thermal Performance ..................................................................................................... 31
9. ORDERING INFORMATION ................................................................................................................ 33
10. REVISION HISTORY .......................................................................................................................... 33