Rockwell Automation 1771-OD16 AC (120V) ISO Output Installation Instructions - Manual (Page 3)

AC (120V) Isolated Output Module, 16 Outputs 3
Publication 1771Ć5.21 -February 1997
EMC Directive
This product is tested to meet Council Directive 89/336/EEC
Electromagnetic Compatibility (EMC) and the following standards,
in whole or in part, documented in a technical construction file:
•
EN 50081-2EMC – Generic Emission Standard,
Part 2 – Industrial Environment
•
EN 50082-2EMC – Generic Immunity Standard,
Part 2 – Industrial Environment
This product is intended for use in an industrial environment.
Low Voltage Directive
This product is tested to meet Council Directive 73/23/EEC
Low Voltage, by applying the safety requirements of EN 61131–2
Programmable Controllers, Part 2 – Equipment Requirements and
Tests.
For specific information required by EN 61131-2, see the appropriate
sections in this publication, as well as these Allen-Bradley
publications:
•
Industrial Automation Wiring and Grounding Guidelines For
Noise Immunity, publication 1770-4.1
•
Guidelines for Handling Lithium Batteries, publication AG-5.4
•
Automation Systems Catalog, publication B111
You can place your module in any I/O module slot of the I/O chassis
except for the left-most slot. The left-most slot is reserved for
programmable controller processors or adapter modules. Group your
modules to minimize adverse effects from radiated electrical noise
and/or heat. We recommend the following:
!
ATTENTION: Remove power from the 1771 I/O
chassis backplane and wiring arm before removing or
installing an I/O module.
•
Failure to remove power from the backplane or wir-
ing arm could cause module damage, degradation of
performance, or injury.
•
Failure to remove power from the backplane could
cause injury or equipment damage due to possible
unexpected operation.
•
Group analog input and low voltage dc modules away from ac
modules or high voltage dc modules to minimize electrical noise
interference.
•
Place analog input modules and other I/O modules sensitive to
heat away from slot power supplies to minimize adverse heat
effects.
Determining Module
Placement in the I/O
Chassis