Rockwell Automation 8510 Hardware/Firmware Replacement Instructions - Manual (Page 7)

8510 Hardware/Firmware Replacement
Instructions
7
o 5. Firmware Replacement
The control firmware for the 8510 is contained in two IC packages, on
two printed circuit boards. The firmware must be replaced as a set to
assure compatibility between the two boards. This kit contains the 2
packages required, plus an EEPROM (programmed with default
parameters) if needed.
a) Assure that all power has been removed and 30 seconds has elapsed.
Refer to the ESD precaution on page 1 and apply grounding wrist
strap.
b) Remove the front cover from the drive.
c) Label and remove any cables from the I/O Board. Remove the I/O
Board by taking out the four corner mounting screws and carefully
separating the connectors.
d) Remove the Display & Keypad Module (from the I/O Board) by
taking the four screws (that secure the assembly) out from the back of
I/O Board and carefully separate the connector.
e) The smaller EPROM (IC package) is located on the Main
Control/CPU Board. Using Figure 1, find the location for this
EPROM.
f) Carefully remove the existing EPROM from its socket noting
orientation of notch.
Important: It is recommended that a chip (integrated circuit) puller
be used. If a puller is not available, a less desirable alternative is to
use a small, flat blade screwdriver. The screwdriver is first inserted
under one end of the IC and then the other end. This method can be
used to help lift the IC from its socket. If the screwdriver method is
used, extreme caution must be taken so that surrounding components
are not damaged.
g) Carefully insert the new EPROM into position, noting orientation.
Care must be used to assure that all pins are properly aligned and
inserted. After insertion, assure that all pins are properly seated in
the socket.
h) The larger IC package is the H8 microprocessor (with internal
EPROM). This package is located on the I/O Board and can be very
difficult to remove. In addition, damage to surrounding components
can occur if care is not taken. Refer to Figure 1 for location and the
“Important” statement above before removing the IC package.
Remove IC package noting notch orientation.