Document history page – Cypress CY7C1462AV33 User Manual

Page 27

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CY7C1460AV33
CY7C1462AV33
CY7C1464AV33

Document #: 38-05353 Rev. *D

Page 27 of 27

Document History Page

Document Title: CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM
with NoBL™ Architecture
Document Number: 38-05353

REV.

ECN No.

Issue Date

Orig. of

Change

Description of Change

**

254911

See ECN

SYT

New Data sheet
Part number changed from previous revision. New and old part number differ
by the letter “A”

*A

303533

See ECN

SYT

Changed H9 pin from V

SSQ

to V

SS

on the Pin Configuration table for 209

FBGA on Page # 5
Changed the test condition from V

DD

= Min to V

DD

= Max for V

OL

in the

Electrical Characteristics table
Replaced

Θ

JA

and

Θ

JC

from TBD to respective Thermal Values for All

Packages on the Thermal Resistance Table
Changed I

DD

from 450, 400 & 350 mA to 475, 425 & 375 mA for 250, 200

and 167 MHz respectively
Changed I

SB1

from 190, 180 and 170 mA to 225 mA for 250, 200 and 167

MHz respectively
Changed I

SB2

from 80 mA to 100 mA for all frequencies

Changed I

SB3

from 180, 170 & 160 mA to 200 mA for 250, 200 and 167 MHz

respectively
Changed I

SB4

from 100 mA to 110 mA for all frequencies

Changed C

IN

, C

CLK

and C

I/O

to 6.5, 3 and 5.5 pF from 5, 5 and 7 pF for TQFP

Package
Changed t

CO

from 3.0 to 3.2 ns and t

DOH

from 1.3 ns to 1.5 ns for 200 MHz

Speed Bin
Added lead-free information for 100-pin TQFP and 165 FBGA and 209 BGA
packages

*B

331778

See ECN

SYT

Modified Address Expansion balls in the pinouts for 165 FBGA and 209 BGA
Package as per JEDEC standards and updated the Pin Definitions accord-
ingly
Modified V

OL,

V

OH

test conditions

Changed C

IN

, C

CLK

and C

I/O

to 7, 7and 6 pF from 5, 5 and 7 pF for 165 FBGA

Package
Added Industrial Temperature Grade
Changed I

SB2

and I

SB4

from 100 and 110 mA to 120 and 135 mA respectively

Updated the Ordering Information by Shading and Unshading MPNs as per
availability

*C

417509

See ECN

RXU

Converted from Preliminary to Final
Changed address of Cypress Semiconductor Corporation on Page# 1 from
“3901 North First Street” to “198 Champion Court”
Changed I

X

current value in MODE from –5 & 30

µA to –30 & 5 µA respec-

tively and also Changed I

X

current value in ZZ from –30 & 5

µA to –5 & 30

µA respectively on page# 18
Modified test condition from V

IH

< V

DD

to

V

IH

< V

DD

Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in the
Electrical Characteristics Table
Replaced Package Name column with Package Diagram in the Ordering
Information table
Replaced Package Diagram of 51-85050 from *A to *B

*D

473229

See ECN

NXR

Added the Maximum Rating for Supply Voltage on V

DDQ

Relative to GND

Changed t

TH

, t

TL

from 25 ns to 20 ns and t

TDOV

from 5 ns to 10 ns in TAP

AC Switching Characteristics table
Updated the Ordering Information table.

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