ADLINK CoreModule 745 - Manual (Page 2)

Notice Page
DISCLAIMER
ADLINK Technology, Incorporated makes no representations or warranties with respect to the contents of
this manual or of the associated ADLINK products, and specifically disclaims any implied warranties of
merchantability or fitness for any particular purpose. ADLINK shall under no circumstances be liable for
incidental or consequential damages or related expenses resulting from the use of this product, even if it has
been notified of the possibility of such damages. ADLINK reserves the right to revise this publication from
time to time without obligation to notify any person of such revisions. If errors are found, please contact
ADLINK at the address shown at the bottom of this page.
Audience
This manual provides reference only for computer design engineers, including but not limited to hardware
and software designers and applications engineers. ADLINK Technology, Inc. assumes you are qualified to
design and implement prototype computer equipment.
ii Reference Manual CoreModule 745
TRADEMARKS
CoreModule and the Ampro logo are registered trademarks, and ADLINK, Little Board, LittleBoard,
MightyBoard, MightySystem, MilSystem, MiniModule, ReadyBoard, ReadyBox, ReadyPanel,
ReadySystem, and RuffSystem are trademarks of ADLINK Technology, Inc. All other marks are the
property of their respective companies.
REVISION HISTORY
ADLINK Technology, Incorporated
5215 Hellyer Avenue, #110
San Jose, CA 95138-1007
Tel. 408 360-0200
Fax 408 360-0222
www.adlinktech.com
© Copyright 2010, 2011, 2012, 2013 ADLINK Technology, Incorporated
Revision Reason for Change Date
1000 Initial Release Nov/10
1010 Replaced N450, D410, and D510 CPUs with N455 and D525; added
JP3 and JP4 to Table 2-3 and removed JP1 (CMOS reset); changed
J10 to J19 in Table 3-10 caption; revised Table 3-9 caption to J10;
revised voltage of battery in Table 3-17 from 5V to 3.3V; changed
width in Table 2-4 from 3.76" to 3.8"; added heatsink dwg and table;
changed pitch in Table 3-15 to 0.079"; revised Ethernet Interface
description on page 27 ; added Gb Ethernet controller to table
Table 3-14 ; revised Appendix A address information
Mar/12
1020 Added airflow diagrams to “Thermal/Cooling Requirements” on
page 16 ; added details to descriptions of Copper and Aluminum
heatsink qualifications in Table 2-7 ; changed Serial Console to
Remote Access in Chapter 3 ; changed voltage of battery header to
+3.0; updated contact addresses in Appendix A
Oct/13