Product overview, Icp-cm – Inova PD00941013.001 User Manual

Page 16

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©2004 Inova Computers GmbH

Page 1-6

Doc. PD00941013.001

Product Overview

ICP-CM

*Notes: CPUs fitted with HD, FD or CD-ROM etc. have a max. operational temp. of 50

°

C.

Rear I/O D necessitates backplanes being PICMG 2.0 Rev. 3.0 compatible

Additional 82551 controller

Universal bridge (Master or Slave)

Ī

Serialized interrupts

Ī

Universal (3.3/5.0V) V I/O support

Ī

32-bit and Rear I/O

Ī

Dual 10/100 Mbit/s Fast Ethernet

Ī

1x front-panel 480Mbit/s, USB 2.0, (1x rear-panel 12Mbit/s, USB 1.1)

Ī

VGA (chipset or AGP)

Standard to all CPU variants is option ‘D’:

Ī

VGA (chipset or AGP if installed)

Ī

Fast Ethernet ETH 1 (Intel 82551)

Ī

USB 1.1

Ī

PS-2 mouse & keyboard

Ī

2

nd

IDE channel (Master & Slave)

Ī

Software configurable

Ī

LPT1 or

Ī

COM1 & COM2 or

Ī

Floppy disk (A or B - BIOS selectable)

Ī

Reset & Beeper

1.44MByte 3.5” floppy drive and EIDE (standard 40-pin header - 80-strand
ATA-5 compatible) supporting 2 pairs (Master/Slave) hard-disks or CD ROMs

8HP front-panel with 2x USB 2.0, COM1, COM2, combined PS-2 mouse &
keyboard; 12HP panel has LPT

USB (USB), 2x RJ45 (Ethernet), 9/15-pin D-Sub (Graphic piggyback) or 15-pin
high-density D-Sub (VGA)

Ī

Universal (transparent/non-transparent) PCI/PCI bridge for Master/Slave

operation

Ī

PICMG 2.0 R3.0, 32/64-bit, 33MHz system slot interface with 7 Master

(DMA) support.

Ī

Full Hot-Swap according to PICMG2.1 R2.0

3U (100 x 160mm) x 21/42mm (4TE/8TE)

Typ. 15W

Windows

®

XP, Windows

®

2000, Windows

®

NT, Windows

®

9x, Linux, VxWorks

®

,

QNX

®

, OS9

220g (4TE)

>220,000 hours @ 20

°

C

0

°

C to +65

°

C (Std.) -40

°

C to +85

°

C (Opt.)

Passive cooling requires - refer to Table 1.51 for details
-40

°

C to +85

°

C

5% to 95% (non-condensing)
Three-year limited warranty
PICMG 2.0 R3.0; CE

Fast Ethernet

PCI/PCI

On-Board I/O

Rear I/O

Mass Storage

Front-Panels

Connectors

CompactPCI

Mechanics

Power Cons.

Software Sup-
port

Mass

MTBF

Oper. Temp.

Storage Temp.

Humidity
Warranty
Conformance

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