VEGA VEGADIF 65 Profibus PA - Manual (Page 78)

78
11 Supplement
VEGADIF 65 • Profibus PA
36129-EN-130417
Long-term stability (according to DIN 16086 and IEC 60770-1)
Applies to digital interfaces (HART, Profibus PA, Foundation Fieldbus) as well as to analogue cur-
rent output 4 … 20 mA. Specifications refer to the measuring range final value.
Measuring ranges 1 year 5 years
10 mbar, 100 mbar ±0.18 % -
500 mbar, 3 bar, 16 bar ±0.05 % ±0.125 %
Ambient conditions
Ambient, storage and transport temperature
Ʋ Standard version -40 … +80 °C (-40 … +176 °F)
Ʋ Version for oxygen applications 19) -40 … +60 °C (-40 … +140 °F)
Ʋ Versions IP 66/IP 68 (1 bar) connec-
tion cable PE
-20 … +60 °C (-4 … +140 °F)
Ʋ Versions IP 66/IP 68 (1 bar) and IP 68,
connection cable PUR
-20 … +80 °C (-4 … +176 °F)
Process conditions
The pressure and temperature specifications are used as overview. In general, the max. pressure
for the pressure transmitter depends on the weakest (with regard to pressure) link. In detail, the
respective specifications of the type label apply.
Process temperature limits
Specifications apply to the basic version as well as to the minus side with version with single
chemical seal 20)
Ʋ With measuring cells PN 420 Lower temperature limit -10 °C (+14 °F).
Ʋ With effective pressure lines longer
than 100 mm
-40 … +120 °C (-40 … +248 °F)
Ʋ With effective pressure lines longer
than 100 mm, process fitting steel
C22.8
-40 … +120 °C (-40 … +248 °F)
Specifications apply to suitable chemical seals
Ʋ Chemical seal CSS plus side, CSB
both sides
-40 … +400 °C (-40 … +752 °F)
Process temperature limits according to the seal material
Seal material Temperature limits
FKM -20 … +85 °C (-4 … +185 °F)
FFKM (Kalrez 6375) -5 … +85 °C (23 … +185 °F)
EPDM -40 … +85 °C (-40 … +185 °F)
PTFE -40 … +85 °C (-40 … +185 °F)
NBR -20 … +85 °C (-4 … +185 °F)
Copper -40 … +85 °C (-40 … +185 °F)
Copper, for oxygen application -20 … +60 °C (-4 … +140 °F)
FKM, cleaned -10 … +85 °C (+14 … +185 °F)
19) Up to 60 °C (140 °F).
20) For the version for oxygen application, note chapter "Oxygen applications".