Q-tech, Class b+ products, Thermal characteristics – Q-Tech CLASS B+ User Manual

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Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-tech.com

17 of 27

Q-TECH

CORPORATION

QPDS-0001, Rev L, June 2013 (ECO #10851)

CLASS B+ PRODUCTS

HIGH RELIABILITY HYBRID CRYSTAL CLOCK OSCILLATORS

2.5 to 5.0Vdc - 15kHz to 350MHz

Differential Output of a

QT93NW10M-312.500MHz

Frequency vs. Temperature Curve

15-Day Aging of a QT122L10S-200MHz

Test Circuit

-

-

Output

Ground

0.1µF

15pF

Tristate Function

Power
supply

10k

mA

Vdc

+

+

+

(*)

or

0.01µF

(*) CL includes probe and jig capacitance

Typical test circuit for CMOS logic

4

3

2

1

QT178

-5

-4

-3

-2

-1

0

1

2

3

4

5

-50

-40

-30

-20

-10

0

10

20

30

40

50

-55

-45

-35

-25

-15

-5

5

15

25

35

45

55

65

75

85

95

105

115

125

Frequency Stability (PPM)

Temperature (°C)

Frequency-Temperature Curve

QTX88LD9M-48.21MHz

45º

45º

Hybrid Case

Substrate

Die

D/A epoxy

D/A epoxy

Heat

Die

R1

D/A epoxy

Substrate

D/A epoxy

Hybrid Case

R2

R3

R4

R5

Thermal Characteristics

JA

JC

CA

Die

T

T

T

C

A

J

CA

JC

(Figure 1)

(Figure 2)

The Tristate function on pin 1 has a built-in pull-up resistor typical 50kΩ, so it can

be left floating or tied to Vdd without deteriorating the electrical performance.

The heat transfer model in a hybrid package is described in figure 1.

Heat spreading occurs when heat flows into a material layer of

increased cross-sectional area. It is adequate to assume that spreading

occurs at a 45° angle.

The total thermal resistance is calculated by summing the thermal

resistances of each material in the thermal path between the device

and hybrid case.

RT = R1 + R2 + R3 + R4 + R5

The total thermal resistance RT (see figure 2) between the heat source

(die) to the hybrid case is the Theta Junction to Case (Theta JC)

in°C/W.

• Theta junction to case (Theta JC) for this product is 30°C/W.

• Theta case to ambient (Theta CA) for this part is 100°C/W.

• Theta Junction to ambient (Theta JA) is 130°C/W.

Maximum power dissipation PD for this package at 25°C is:

• PD(max) = (TJ (max) – TA)/Theta JA

• With TJ = 175°C (Maximum junction temperature of die)

• PD(max) = (175 – 25)/130 = 1.15W

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