GE Industrial Solutions EBDW020A0B Barracuda Series - Manual (Page 13)

GE
Data Sheet
EBDW020A0B Barracuda™ Series; DC-DC Converter Power Modules
36-75Vdc Input; 12.0Vdc, 20.0A, 240W Output
April 15, 2013 ©2012 General Electric Company. All rights reserved. Page 13
Thermal Considerations (continued)
Layout Considerations
The EBDW020A0B power module series are low profile in order
to be used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited. Avoid placing
copper areas on the outer layer directly underneath the power
module. Also avoid placing via interconnects underneath the
power module.
For additional layout guide-lines, refer to FLT007A0Z Data
Sheet.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant, Z version, through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. The non-Z version products use lead-tin (Pb/Sn)
solder and RoHS-compliant components. Both version
modules are designed to be processed through single or dual
wave soldering machines. The pins have an RoHS-compliant,
pure tin finish that is compatible with both Pb and Pb-free
wave soldering processes. A maximum preheat rate of 3C/s is
suggested. The wave preheat process should be such that the
temperature of the power module board is kept below 210C.
For Pb solder, the recommended pot temperature is 260C,
while the Pb-free solder pot is 270C max. Not all RoHS-
compliant through-hole products can be processed with
paste-through-hole Pb or Pb-free reflow process. If additional
information is needed, please consult with your GE
representative for more details.
Reflow Lead-Free Soldering Information
The RoHS-compliant through-hole products can be processed
with the following paste-through-hole Pb or Pb-free reflow
process.
Max. sustain temperature :
245C (J-STD-020C Table 4-2: Packaging Thickness>=2.5
mm /
Volume > 2000 mm 3 ),
Peak temperature over 245C is not suggested due to the
potential reliability risk of components under continuous high-
temperature.
Min. sustain duration above 217C : 90 seconds
Min. sustain duration above 180C : 150 seconds
Max. heat up rate: 3C/sec
Max. cool down rate: 4C/sec
In compliance with JEDEC J-STD-020C spec for 2 times reflow
requirement.
Pb-free Reflow Profile
BMP module will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both Pb-
free solder profiles and MSL classification
procedures. BMP will comply with JEDEC J-STD-020C
specification for 3 times reflow requirement. The suggested
Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended
linear reflow profile using Sn/Ag/Cu solder is shown in Figure
24.
Time
T
e
m
p
Ramp up
max. 3 °C/Sec
Ramp down
max. 4 °C/Sec
Time Limited 90 Sec.
above 217°C
Preheat time
100-150 Sec.
Peak Temp. 240 -245 °C
25 °C
150 °C
200 °C
217 °C
Figure 24. Recommended linear reflow profile using
Sn/Ag/Cu solder.
MS L Rating
The EBDW020A0B modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are required for
MSL ratings of 2 or greater. These sealed packages should not
be broken until time of use. Once the original package is
broken, the floor life of the product at conditions of 30°C and
60% relative humidity varies according to the MSL rating (see
J-STD-020A). The shelf life for dry packed SMT packages will
be a minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90% relative
humidity.
O
U
TPUT CU
RRE
NT, I
O
(A)
LOCAL AMBIENT TEMPERATURE, T
A
(C)
Figure 23. Output Current Derating for the Base Plate
EBDW020A0Bxx-H and 0.25” heat sink in the Transverse
Orientation; Airflow Direction from Vin(-) to Vin(+); Vin =
48V.