Recommended processing parameters, Reflow parameter, Temperature (°c) – PNI ASIC User Manual
Page 19: Time (sec), Preheat temperature (tsmin to tsmax), 150°c – 200°c, Temperature tl (typical solder melting point), 218°c, Tsmax to tl ramp-up rate, 3°c/second max
Recommended Processing Parameters
Figure 11: Lead Free Reflow Profile
Table 14 Recommended Processing Parameters
a
Reflow Parameter
Temperature (°C)
Time (sec)
Preheat Temperature (T
Smin
to T
Smax
)
150°C – 200°C
60-180
Temperature T
L
(typical solder melting point)
>218°C
T
Smax
to T
L
Ramp-up Rate
3°C/second max
Peak Temperature T
P
260°C
Time 25°C to Peak T
P
6 minute max
Time Maintained Above Temperature T
L
(t
L
)
218°C
60-120
Soak (time within 5° of actual Peak T
P
)
10-20
Ramp-down Rate
4°C/second max
a. Meets lead-free profile recommendations (IPC/JEDEC J-STD-020)
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