Recommended processing parameters, Reflow parameter, Temperature (°c) – PNI ASIC User Manual

Page 19: Time (sec), Preheat temperature (tsmin to tsmax), 150°c – 200°c, Temperature tl (typical solder melting point), 218°c, Tsmax to tl ramp-up rate, 3°c/second max

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Recommended processing parameters, Reflow parameter, Temperature (°c) | Time (sec), Preheat temperature (tsmin to tsmax), 150°c – 200°c, Temperature tl (typical solder melting point), 218°c, Tsmax to tl ramp-up rate, 3°c/second max | PNI ASIC User Manual | Page 19 / 19 Recommended processing parameters, Reflow parameter, Temperature (°c) | Time (sec), Preheat temperature (tsmin to tsmax), 150°c – 200°c, Temperature tl (typical solder melting point), 218°c, Tsmax to tl ramp-up rate, 3°c/second max | PNI ASIC User Manual | Page 19 / 19
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