Electrical and thermal specifications – Agilent Technologies HDMP-3001 User Manual
Page 107
107
Table 23. Absolute Maximum Ratings
Parameter
Min
Max
Units
Supply Voltage (VDD)
-0.5
2.5
Volts
Supply Voltage (DVDD)
-0.5
4.5
Volts
Junction Temperature
0.0
110
°
C
Storage Temperature
-40
125
°
C
ESD
2
KV
Caution: Exceeding the values stated above could permanently damage the device.
Prolonged exposure to absolute maximum ratings may affect the reliability of
the device.
7. Electrical and Thermal Specifications
7.1 Technology
0.25 micron CMOS, 1.8V core and 3.3V I/Os.
7.2 Maximum Ratings
Table 24. Operating Conditions
Parameter
Min
Typ
Max
Units
Supply Voltage (DVDD)
2.97
3.3
3.63
Volts
Supply Voltage (VDD)
1.62
1.8
1.98
Volts
Case Temperature
0
25
85
°
C
7.3 Thermal Characteristics
Table 25. Thermal Performance
Symbol Parameter
Units
Typ.
Max.
θ
JA
(1)
Thermal Resistance: Junction to Ambient
°
C/W
34
ψ
JT
(2)
Thermal Characterization Parameter: Junction to Package Top
°
C/W
10.25
Notes:
1.
θ
JA
is measured in a still air environment at 25
°
C on a standard 4 x 4" FR4 PCB as specified in EIA/JESD 51-7.
2.
To determine the actual junction temperature in a given application, use the following: T
J
= T
T
+ (
ψ
JT
x P
D
), where T
T
is the case
temperature measured on the top center of the package and P
D
is the power being dissipated.