Agilent Technologies HDMP-3001 - Manual (Page 4)

4
List of Tables
Table 1. Line Side Interface Pins Description ........................................... 8
Table 2. MII Interface Pins Description ..................................................... 9
Table 3. Transport Overhead Pins Description ...................................... 10
Table 4. Microprocessor Interface Pins Description ............................. 12
Table 5. JTAG Interface Pins Description ............................................... 13
Table 6. Two-Wire EEPROM Interface Pins Description ...................... 14
Table 7. Miscellaneous Pins Description ................................................. 14
Table 8. Buffer types .................................................................................. 16
Table 9. JTAG pins ...................................................................................... 21
Table 10. JTAG instructions supported ................................................... 21
Table 11. Path RDI bit values .................................................................... 27
Table 12. STS-3c/STM-1 TOH/SOH ........................................................... 28
Table 13. Pointer Processing ..................................................................... 34
Table 14. Pointer Tracking ........................................................................ 34
Table 15. INT Pin Configuration ............................................................... 39
Table 16. Pin Connections – MPC860 ...................................................... 40
Table 17. Pin Connections – MII Interface. ............................................. 41
Table 18. MII Management Register Map ................................................ 42
Table 19. HDMP-3001 Register Map ......................................................... 44
Table 20. G1 values ..................................................................................... 59
Table 21. STS-3c/STM-1 Configuration for
RX_FRAME_POSITION [3:0] .......................................................... 64
Table 22. Package Dimensions ............................................................... 106
Table 23. Absolute Maximum Ratings ................................................... 107
Table 24. Operating Conditions .............................................................. 107
Table 25. Thermal Performance ............................................................. 107
Table 26. DC Electrical Characteristics ................................................. 108
Table 27. Power Dissipation .................................................................... 108
Table 28. Clock requirements and switching characteristics ............. 108
Table 29. MII AC Specification ................................................................ 109
Table 30. Timing of microprocessor bus ............................................... 112
Table 31. MII signal clocking ................................................................... 117
Table 32. EEPROM Interface Timing Parameters ................................ 118
This IC was jointly developed with Wuhan Research Institute of Post and Telecommunications