Linx Technologies HUM-xxx-RC - Manual (Page 26)

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Microstrip Details
A transmission line is a medium whereby RF energy is transferred from
one place to another with minimal loss. This is a critical factor, especially in
high-frequency products like Linx RF modules, because the trace leading
to the module’s antenna can effectively contribute to the length of the
antenna, changing its resonant bandwidth. In order to minimize loss and
detuning, some form of transmission line between the antenna and the
module should be used unless the antenna can be placed very close (<
1 ⁄
8
in)
to the module. One common form of transmission line is a coax cable and
another is the microstrip. This term refers to a PCB trace running over a
ground plane that is designed to serve as a transmission line between the
module and the antenna. The width is based on the desired characteristic
impedance of the line, the thickness of the PCB and the dielectric constant
of the board material. For standard 0.062in thick FR-4 board material, the
trace width would be 111 mils. The correct trace width can be calculated
for other widths and materials using the information in Figure 45 and
examples are provided in Figure 46. Software for calculating microstrip lines
is also available on the Linx website.
Trace
Board
Ground plane
Figure 45: Microstrip Formulas
Example Microstrip Calculations
Dielectric Constant
Width / Height
Ratio (W / d)
Effective Dielectric
Constant
Characteristic
Impedance (Ω)
4.80 1.8 3.59 50.0
4.00 2.0 3.07 51.0
2.55 3.0 2.12 48.8
Figure 46: Example Microstrip Calculations
Do not route PCB traces directly under the module. There should not be
any copper or traces under the module on the same layer as the module,
just bare PCB. The underside of the module has traces and vias that could
short or couple to traces on the product’s circuit board.
The Pad Layout section shows a typical PCB footprint for the module. A
ground plane (as large and uninterrupted as possible) should be placed on
a lower layer of your PC board opposite the module. This plane is essential
for creating a low impedance return for ground and consistent stripline
performance.
Use care in routing the RF trace between the module and the antenna
or connector. Keep the trace as short as possible. Do not pass it under
the module or any other component. Do not route the antenna trace on
multiple PCB layers as vias add inductance. Vias are acceptable for tying
together ground layers and component grounds and should be used in
multiples.
Each of the module’s ground pins should have short traces tying
immediately to the ground plane through a via.
Bypass caps should be low ESR ceramic types and located directly
adjacent to the pin they are serving.
A 50-ohm coax should be used for connection to an external antenna.
A 50-ohm transmission line, such as a microstrip, stripline or coplanar
waveguide should be used for routing RF on the PCB. The Microstrip
Details section provides additional information.
In some instances, a designer may wish to encapsulate or “pot” the
product. There are a wide variety of potting compounds with varying
dielectric properties. Since such compounds can considerably impact
RF performance and the ability to rework or service the product, it is
the responsibility of the designer to evaluate and qualify the impact and
suitability of such materials.