IBM C2B 2.25 Brick On Sled carrier 128-pin HPC - Manual (Page 78)

USER RESPONSIBLE F O R V E R I F Y I N G VERSION A N D COMPLETENESS
O E M F U N C T I O N A L SPECIFICATION ULTRASTAR X P (DFHC) SSA M O D E L S 1.12/2.25 GB - 1.0" H I G H
Table 15. Maximum and Reliability Operating Temperature Limits
Maximum Reliability
Disk Enclosure Top 158˚ F (70˚ C) 131˚ F (55˚ C)
Disk Enclosure Bottom 158˚ F (70˚ C) 131˚ F (55˚ C)
P R D F Prime Module 203˚ F (95˚ C) 176˚ F (80˚ C)
W D 61C40 Module 185˚ F (85˚ C) 167˚ F (75˚ c)
SIC Module 203˚ F (95˚ C) 176˚ F (80˚ C)
Microprocessor Module 194˚ F (90˚ C) 167˚ F (75˚ C)
VCM F E T 194˚ F (90˚ C) 167˚ F (75˚ C)
D C / D C Converter (CxB only) 185˚ F (85˚ C) 167˚ F (75˚ C)
SMP F E T 194˚ F (90˚ C) 167˚ F (75˚ C)
Note 1: Module temperature measurements should be taken from the top surface of the module.
Note 2: If copper tape is used to attach temperature sensors, it should be no larger than 6 square milli-
meters.
notes: 1) dimensions are in millimeters.
Figure 22. Temperature Measurement Points for All Models (top view of DE)
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